Industrial SSD Flash, Industrial Embedded Flash Modules, Industrial DRAM, Industrial Memory Card, Mini PCIe Expansion Cards | Cervoz Co., Ltd. – Making Memories for Industry

Cervoz develops, produces and markets industrial storage and memory products for the professional, critical, and diverse industrial applications. Established in 2006, Cervoz specializes in embedded components for the demanding Industrial PC market and has built up our industry experience for over a decade. We deeply understand this industry, and thus are able to offer our high quality embedded products with legacy and mainstream technology, long-term availability, BOM (bill of material) control, high reliability and top compatibility.

Cervoz High-Capacity Storages

Cervoz offers a wide range of high-capacity storage solutions that are highly reliable, fast, compact, and can operate stably from -40˚C to 85˚C.

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InvitationEmbedded World 2022

Cervoz returns to Embedded World 2022 with new products echoing trending topics.

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Smart Bus Solutions

Catch Industrial -Grade Storage Solutions for Smart Buses

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New DDR5 Industrial Grade DRAM Modules

Cervoz Announces New DDR5 Industrial Grade DRAM Modules for Diversified Industrial Applications

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New M.2 Expansion Solutions

Cervoz Unveils New Modular Expansion Card to Optimize Expandability - New M.2 2242/ 2260/ 2280

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Making Memories for Industry

Press Center

  • 15-06-2022

    Cervoz High-Capacity Storages

    Cervoz High-Capacity Storages for Data-Intensive Workloads The demand for HPC (high-performance computing) and big data systems has grown widely since they can process data and perform complex calculations at high speeds. Storage solutions for HPC applications must be reliable, with high capacity and transmission speed, and withstand high temperatures and even overheating.   Cervoz High-Capacity Storages Promotion   Cervoz offers a wide range of high-capacity storage solutions that are highly reliable, fast, compact, and can operate stably from -40˚C to 85˚C. They are ideal for data-intensive HPC workloads to perform at their peak. In addition, the specialized DRAM buffer and Powerguard (Power Loss Protection) mechanism improve the endurance of our flash modules.   Explore Cervoz Storage Solutions Now   Family T380 T385 T376 T405 T435 Interface SATA III  SATA-III  SATA-III PCIe Gen. 3x4 PCIe Gen. 3x4 Flash Type TLC Capacity 512GB/1TB/2TB 512GB/1TB Powerguard (Power Loss Protection) With DRAM Buffer Operating Temp. 0˚C~70˚C/-40˚C~85˚C Form Factors 2.5” SATA, M.2 2242/2280 2.5” SATA 2.5” SATA, M.2 2280 M.2 2242/ M.2 2280 M.2 2242/ M.2 2280   Read also: Cervoz Solution in Distributed AI Next-Generation Server Solution Cervoz 3D NAND Flash Storage Solution   Contact a Cervoz Sales Representative to learn more!  

  • 24-05-2022

    Invitation: embedded world 2022

    Dear Valued Customer,   This year, Cervoz returns to Embedded World 2022 in Nuremberg, Germany, with new products echoing trending Intelligent Transportation, Industrial Automation, 5G Networking and Edge Computing applications. You will find all demonstrated solutions of the latest Storage, Memory, and Module Expansion Card in the show.   To redeem a voucher to attend for free, please enter the ew22466549 code at here. *The website will provide instructions on how to register and participate in the trade show. Visit Cervoz in Embedded World 2022 Date: 21-23 June 2022 Booth: Hall1, Stand 1-401 Place: Nuremberg, Germany Highlights of New Products New DDR5 DRAM Module New PCIe Gen. 4x4 SSD New PCIe Ethernet Expansion Card New M.2 Expansion Solutions Can't wait to find out more? Meet our experts at Embedded World 2022 in Hall1, Booth 1-401, or visit the Cervoz website and contact our sales representatives at to learn more.    

  • 11-05-2022

    Smart Bus Solutions

    Today, over 50% of the world's population lives in urban areas. The portion is estimated to reach nearly 70% by 2050, making transportation one of the toughest challenges for cities around the globe. With the advancement of automotive IoT and 5G communication technologies, ITS (Intelligent Transportation Systems) is being implemented in many cities to improve traffic congestion, safety, and cost-effectiveness. Smart Public Transportations An ITS system is capable of making critical and timely traffic decisions from management centers or roadside infrastructure through networks of sensors, intelligent embedded solutions, distributed computing ability, and wireless connection capabilities. In other words, an ITS uses new and emerging technologies to make moving around a city more convenient, more cost-effective (for both the city and the individual), and safer.  As environmental awareness rises, more and more local governments have set goals to raise the proportion of people using public transport. Many have embraced and developed intelligent public transportation systems to increase efficiency and safety with lower operating costs. Among all, smart buses are considered one of the most welcomed choices for their lower infrastructure costs and faster deployment. Smart Buses         In addition, with video analytics ability and edge AI imbued, it becomes the key to automated services such as total passenger control and AFC (Automated Fare Collection). Meanwhile, smart buses interconnect with the surroundings and the control center through GNSS and IoT technologies. Hence the operator can conduct fleet management and provide better PIS (Passenger Information System) service that delivers essential real-time information to passengers. Furthermore, as smart buses collect traffic data continuously and collaboratively, operators can gain more insights to improve service, enhance utility efficiency, and rearrange routes or timetables when necessary.   Challenges and Solutions Due to the ongoing development of in-vehicle surveillance, communication, and computing technologies, the demand for real-time massive data collection and analysis continues to grow, leveraging the need for large-capacity and high-transfer-speed storage solutions. However, when it comes to in-vehicle applications, the key lies in reliability against tough onboard situations and challenging environments, such as unstable power supply, vibration, extreme temperatures, and humidity Although high temperatures, shock, and vibrations can cause damage and severely reduce the lifespan of electronic devices, these factors are common for in-vehicle systems. All Cervoz in-vehicle products are compliant with ISO-16750-3 standards, ensuring that they can withstand shock and vibration for a continuous 24 hours, and survive a 100cm-6-face drop test. These stress tests simulate the actual conditions of vehicles in an outdoor operation. Our optional Anti-Vibration Fill also can help secure PCB and main chips in their place and prevent solder joints from coming loose. All Cervoz flash storage products come with wide temperature versions that can operate stably between -40˚C to 85˚C. In addition, our in-house developed conformal coating is optional compliant to all our embedded products, protecting the storage from dust and humidity in vehicles. With the emergence of electric transportation, power supply instability and outages may pose problems for owners and operators. Cervoz Powerguard is our firmware-and-hardware integrated power loss protection technology. Powerguard provides additional power to the memory during an unexpected power outage to complete the current flash write operation and protect data integrity and the firmware. Meanwhile, its under-voltage protection feature prevents recording erroneous and incomplete data, which may damage data validity and the device during a power outage. Cervoz Industrial T376 family is a line-up of high-capacity and high-transmission-speed 3D TLC SSDs with Powerguard function and DRAM buffer design. The DRAM Buffer technology utilizes an additional DRAM that functions the way a cache does in a hard disk to increase the products' performance, endurance, and lifespan. The line-up consists of multiple form factors, including 2.5” SATA, mSATA, and M.2 2280, all compliant with the SATA III interface. Know more about Cervoz's solutions for: Smart EV Chargers Parking Lots Smart Traffic Management Contact a Cervoz Sales Rep. to learn more.


  • 3D NAND Flash

    3D NAND is the latest in flash memory technology that has significantly increased performance and capacity for each unit of cell. While 2D NAND builds a flat, one-story cell structure, 3D NAND takes advantage of the space above, building a vertical structure that can therefore accomplish more. With 3D NAND flash, the SSD performs faster and better while consuming less power and costing less per GB. 3D NAND is developed and designed to overcome the limitations of current planar technology, accomplishing the aforementioned advantages without sacrificing product reliability.