Cervoz is proud to showcase our latest innovations at Embedded World North America 2024. Join us at booth #1961 in Austin, USA, from October 8-10, and discover how we’re shaping the future of automation—with an early glimpse available in our teaser video. Versati...
Get ready for a major revelation at Embedded World North America 2024! Cervoz is bringing something truly exciting to Booth #1961, and we are k...
Join Cervoz at Embedded World North America 2024 Embedded World, the premier event for the global embedded community, makes its North American deb...
Advancing Embedded Computing Capabilities Introducing the Cervoz MEC-USB-2012 series modular...
In today's fast-paced technological landscape, staying competitive requires proactive stra...
Dear Valued Customer, Your insightful presence at our Cervoz booth during AUTOMATION EXPO 2...
3D NAND is a type of non-volatile flash memory in which the memory cells are stacked vertically in multiple layers.
Power Loss Protection (PLP)
A DRAM chip in a flash module functions the way a cache does in a hard disk.
Advanced LDPC ECC engine is an error-correcting mechanism.
This mechanism is to prevent SSD from overheating.
An effective methodology to ensure data integrity.
Cervoz's Military Grade SSD is designed to protect the most sensitive data in extreme environmental conditions.
Cervoz FlashMonitor is a proprietary monitoring software developed in-house to monitor flash disk health.
The Reliability-Optimized MLC (RO-MLC) technology uses MLC NAND but with a special firmware that manipulates cell storage at the block level simulating SLC technology.
Self-Monitoring, Analysis, and Reporting Technology.
Cervoz's Wide Temperature flash and memory modules are designed for extreme environments, capable of withstanding temperatures from -40˚C to 85˚C. Wide Temperature denotes memory and storage products that support a wider than typical range of temperatures in which they can maintain normal function.
Conformal coating is a thin protective film applied to products to protect against moisture, dust, chemicals, and sunlight.
The anti-vibration fill is a filling that can keep Flash and DRAM modules intact and help protect them from shock and vibration.
Isolation describes the design of modular expansion cards whereby the input and output circuits are electrically and physically separated.
Write protection is used to denote the locking mechanism which prevents modification or deletion of data on a storage device.
For emergency data erase –the process only takes a few seconds.
The data is permanently destroyed and unrecoverable.
AES 256-bit encryption refers to the process of concealing plaintext data using the AES algorithm and an AES key length of 256 bits.
Cervoz designed flash, DRAM modules, and modular expansion cards of small form factors to fit in the compact, limited space of the system.
Versatile Mounting Mechanism for Mini/ M.2 PCIe Expansion card.
Very Low Profile DRAM
Cervoz is committed to protecting your privacy. To meet the requirements of the new EU General Data Protection Regulation (GDPR), we have updated our Privacy Policy to let you know how we collect data to deliver enhanced content and experience on the Cervoz site.