News Release


Anti-Vibration Fill - Cost Effective Solution to Enhance Robustness

In real-world industrial computing applications, more and smaller embedded devices are installed in harsh environments with constant shock or vibrations. The DRAM modules inside these devices may be vulnerable to these impacts, causing poor contacts and connection.  
Cervoz offer a value-added technology " Anti-Vibration Fill " to enhance the robustness of our all DRAM modules to prevent the solder joints from coming loose. The third party Lab has verified the resistance against  the pull-out force and shear force will be double when the product has Anti-Vibration Fill. Especially for critical applications, such as in-vehicle computing, machine automation, military and so on.

DRAM module is highly recommended for the below mentioned product series.


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