Experience the future of automation at Automate Show 2024, Chicago, USA. Visit Cervoz at Booth #1777, McCormick Place from May 6-9 to discover groundbreaking innovations driving smart manufacturing forward. As automation's premier event, Automate Show showcases the latest industrial...
Cervoz at Automate Show 2024 At the upcoming Automate Show in Chicago, Cervoz will showcase its exceptional automation solutions. Seize th...
Take a look back at Cervoz's standout performance at Embedded World 2024 in Nuremberg. Witness Cervoz's cutting-edge embedded solutions,...
Dear Valued Customer, Thank you for joining us at Embedded World 2024. It was a pleasure to...
The M.2 interface has revolutionized modern computing by enabling the seamless integration of...
Join us at Embedded World 2024 (April 9-11, Hall 1, Booth 1-401) in Nuremberg to explore Cervo...
3D NAND is a type of non-volatile flash memory in which the memory cells are stacked vertically in multiple layers.
Power Loss Protection (PLP)
A DRAM chip in a flash module functions the way a cache does in a hard disk.
Advanced LDPC ECC engine is an error-correcting mechanism.
This mechanism is to prevent SSD from overheating.
An effective methodology to ensure data integrity.
Cervoz's Military Grade SSD is designed to protect the most sensitive data in extreme environmental conditions.
Cervoz FlashMonitor is a proprietary monitoring software developed in-house to monitor flash disk health.
The Reliability-Optimized MLC (RO-MLC) technology uses MLC NAND but with a special firmware that manipulates cell storage at the block level simulating SLC technology.
Self-Monitoring, Analysis, and Reporting Technology.
Cervoz's Wide Temperature flash and memory modules are designed for extreme environments, capable of withstanding temperatures from -40˚C to 85˚C. Wide Temperature denotes memory and storage products that support a wider than typical range of temperatures in which they can maintain normal function.
Conformal coating is a thin protective film applied to products to protect against moisture, dust, chemicals, and sunlight.
The anti-vibration fill is a filling that can keep Flash and DRAM modules intact and help protect them from shock and vibration.
Isolation describes the design of modular expansion cards whereby the input and output circuits are electrically and physically separated.
Write protection is used to denote the locking mechanism which prevents modification or deletion of data on a storage device.
For emergency data erase –the process only takes a few seconds.
The data is permanently destroyed and unrecoverable.
AES 256-bit encryption refers to the process of concealing plaintext data using the AES algorithm and an AES key length of 256 bits.
Cervoz designed flash, DRAM modules, and modular expansion cards of small form factors to fit in the compact, limited space of the system.
Versatile Mounting Mechanism for Mini/ M.2 PCIe Expansion card.
Very Low Profile DRAM
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